355
Turtle Creek Ct. San Jose, CA 95125
Toll Free 800-800-3278
ISO 9001:2000
UL Registered
© 1997 Data Circuit Systems Inc. All Contents and Graphics are the sole property of Data Circuit Systems, Inc. and can not be reused or distributed without the written approval from Data Circuit Systems, Inc.
All version of these documents are uncontrolled and for Reference only.
If you have suggestions or comments on content, please direct to: webmaster@datacircuits.com
Last Modified: 09/15/2006
 |
 |
 |
 |
 |
 |
 |
 |
 |
Data Circuit Systems, Inc. offers our customers a wide range of surface finishes. Contact our DFM Team to get assistance in surface finish technical questions. Look through the wide range of suppliers and find the specific finish that meets your needs. A verity of publications will assist in answering technical questions, process guidelines, and test data. Visit each supplier for additional technical and marketing information.
Feel free to contact any DFM Engineer Directly.
E-mail: dfm@datacircuits.com
(800) 800-3278 Dial "0" and ask for DFM Engineering.
| Reference
Document |
Description |
Size |
|
Many
customers have requested a brief description of alternative surface
finish. There are a wide variety of finishes available from Data Circuit
Systems, and a brief description of them is contained in this document. |
866K |
|
|
This
document details the alternative surface finish for Fine Pitch SMT and
BGA applications |
1000K |
|
|
This
document details the test process and results performed on the Omikron
White Tin. |
728K |
|
| Omikron White Process Guidelines | This document is published by Florida Cirtech detailing Assembly Process Guidelines. |
350K |
|
High performance final finish provides a thin organo-silver deposit. Excellent solderability and low contact resistance. |
187K |
|
|
ENTEK
PLUS Gold is specifically engineered to selectively deposit on copper
while ensuring that the secondary metal surface remains contaminate-free. |
150K |
Below are the main suppliers of raw surface finishes to Data Circuit Systems, Inc. You can Click on the Company Name/Logo to visit their Web Site for additional information.
| Supplier |
Overview |
 |
OMIKRON "The Wave of The Future" The Best Alternative to Hot Air Solder Leveling |
 |
Electroless Nickel Immersion Gold - (ENIG) Currently one of the most widely accepted surface finishes use today. |
|
|
Sterling™ Silver Immersion A Silver metallic solderability preservative that provides a precious metal, oxide-resistant board coating. Surface conductivity provides touchpad functionality, wire-bonding capability, and in-circuit test consistency. |
 |
ENTEK PLUS Gold is specifically engineered to selectively deposit on copper while ensuring that the secondary metal surface remains contaminate-free. |
