ISO 9002 Registered

24 hour multilayer quick-turns

7 days a week, 24 hours a day

24 hour accessibility

1 to 30 layers

3 mil trace & space

4 mil micro vias, 12 mil pads

Blind & buried vias

Controlled impedance

Controlled dielectrics

Micro BGA & SMT

High performance substrates

Via in Pad - Conductive Fill

 

At Data Circuit Systems, finished bare board product features Liquid Photoimagable solder mask over bare copper. Multilayer products from 4 to 30 layers utilize high performance resin/glass furmulations to support high speed digital, high frequency and RF solutions. Standard multilayer packages range from .015" to .250" finished thickness to meet your specific dielectric or impedance requirements.

Process technology at DCS ensures maximum yields on a diverse variety of board level technologies. Process flexibility and ISO quality systems have created the environment to build very complex high density interconnect designs with impressive yields. Process solutions at DCS feature Blind & Buried Vias, Via-in-Pad,Sequential Laminations, Buried Passives, Mixed Signals and variety of resin/glass systems to meet the sophisticated signal challenges presented today.

Tomorrow's continued miniaturization of component features and footprints heightens industry awareness for placement accuracy and bond integrity on micro SMT, BGA, and CSP devices. To ensure coplanarity, DCS offers a choice of alternative finishes including Silver Immersion, Immersion White Tin, Immersion Gold and Entek OSP Plus.